379 karma · joined December 14, 2017
The floppotron
Maybe this is what you're referring to. There are similar examples where people do this with old disk drives and printers too.
HDLs have familiar syntax that makes it seem like you can just program algorithms imperatively (for loops, if statements, functions etc) but it's all just a mean trick to catch software people out, and generally won't give the results you expect.
On top there's then the fact everything happens at the same time, the faff of making everything synchronised and making sure it meets timing and fighting the frankly awful tooling every step of the way.
Once you get it, it's fine, but you have to unlearn a lot of software muscle memory and keep the actual design work (boxes and lines) almost entirely separate from the implementation (typing your boxes and lines into a text editor).
Might sound a bit niche, and it is, but even if you ignore the stuff about actually certifying stuff to fly, it has some extremely useful and interesting tidbits about how to go about running very large and highly complex hardware/firmware projects in safety critical industries.
The chapter on requirements is especially useful, and the whole thing is written in a (relatively, for the topic) light-hearted way.
Not by its inventors, but by its management-type evangelists. Which do you think the mayor had in his ear?
Is this not quite a lot of money?
On the cool side, it's theoretically possible to make them translucent (without the silicon substrate ofc) which could make for cool power generating windows in the future.
On the not so cool side you really don't want the materials anywhere near you or your water table in the event of a panel being damaged. Lead halide perovskites, methylammonium lead iodide, are insanely toxic and a race to the bottom on price if they become widespread could be an environmental disaster waiting to happen.
Not to take from the achievements described here, but there isn't any mention of it. There is some hope in taking the lead out (tin based perovskites) but that tends to result in a drop in efficiency.
I disagree though that 22nm is the limit for (STT) MRAM and ReRAM, they both have excellent scalability.
SRAM scales nicely but is volatile, takes up lots of area and obviously isn't BEOL compatible. You can stack MTJs between metal layers just fine.
I don't know what to think.