If LPCAMM already can't keep up with requirements when it is barely even out, then my guess is it won't fare well going forward.

So 1 of 2 things is probably true:

AMD is not being completely truthful with their statements that LPCAMM wasn't able to work (maybe it was just more difficult/complicated than they were willing to do, but it could work or

latency/speed requirements have already outpaced what LPCAMM can provide and soldered ram is the future.

I really hope it's the former, but it wouldn't be the first time something like the second has occurred. Apparently cache also used to be a separate, swappable component before it became integrated into the die. RAM might end up going the same way.

I guess they'd claim it is only the MAX AMD procs which force soldered RAM, but since they could as well have used a non-MAX chip (and correspondingly reduce the price) this just shows how much of this is an arbitrary, and therefore questionable, decision from Framework rather than any restriction AMD sets.