With no gloves, to boot!
Of course, the real grandmaster move is to use liquid helium - its boiling point is about 70C colder than nitrogen :)
Of course, the real grandmaster move is to use liquid helium - its boiling point is about 70C colder than nitrogen :)
liquid helium might get into the device itself and cause other problems. (e.g. iphones stop working in the presence of helium)
http://cookingissues.com/primers/liquid-nitrogen-primer/#sec...
There are still problems like cpu/board/components not working due to low temperature or condensation. Generally they are solved by better insulation and trying different components until you find ones that work.
Overclocking is 25% cooling and 75% picking parts that can operate at low temperatures and high frequencies.