I also learned that literally pouring liquid nitrogen over a CPU from a cup is a grandmaster overclocker move.
I also learned that literally pouring liquid nitrogen over a CPU from a cup is a grandmaster overclocker move.
Seems like the heat flow would be substantially impeded by any boiling of the LN2.
Or, for that matter, simply using a chilled copper ingot as the heat sink? There must be some threshold at which the limiting problem is getting the heat out of the die, not getting the heat out of the chip's package.
https://www.qats.com/cms/2019/08/02/quantum-computing-coolin...
Of course, the real grandmaster move is to use liquid helium - its boiling point is about 70C colder than nitrogen :)
liquid helium might get into the device itself and cause other problems. (e.g. iphones stop working in the presence of helium)
http://cookingissues.com/primers/liquid-nitrogen-primer/#sec...
There are still problems like cpu/board/components not working due to low temperature or condensation. Generally they are solved by better insulation and trying different components until you find ones that work.
Overclocking is 25% cooling and 75% picking parts that can operate at low temperatures and high frequencies.
“It's a lot easier to control a benchmark which is always the same”, explains Rywak. "A game makes the whole process less predictable in terms of hardware load which could lead to stability issues while working on frozen hardware.”