I remember watching a teardown of a spare-no-expense embedded military computer, and the guy couldn't stop talking about how much "conformal coating" the board had.
Edit: I think this is the video: https://www.youtube.com/watch?v=55z_0BYb5is
I remember watching a teardown of a spare-no-expense embedded military computer, and the guy couldn't stop talking about how much "conformal coating" the board had.
Edit: I think this is the video: https://www.youtube.com/watch?v=55z_0BYb5is
It is not used for Sn (tin) whiskers at all, since it wouldn't penetrate the pads/package of the IC and wouldn't stop such a high modulus process in any case. Whiskers are most problematic with modern Pb-free solders and fine pitch SMT practices (QFNs & BGAs), but it's worth noting that other materials (like Zn) also have significant issues.
> The coating completely penetrates spaces as narrow 0.01mm.
I would have thought that would make it very effective in protecting against whiskers in QFPs that might have a lead pitch of 0.4mm or larger. There's not a lot you can do under the bodies of BGAs and QFNs, but if you're worried about whiskers you're probably using QFPs instead.
This app note suggests that Parylene and a few other dip-type conformal coatings do slow down tin whiskers, but don't stop their spread:
https://www.maximintegrated.com/en/app-notes/index.mvp/id/52...
Here is Mike's BBC micro : https://www.youtube.com/watch?v=la-sGpTpkxE
Great stuff.