2,516 karma · joined January 19, 2014
Also, the GDSII format for IC does not handle curves well. Unlike DXF, it can’t handle a circle, so has to decimate it into a polygon.
When doing signal integrity analysis on PCB, the tools can break those long runs of straight, parallel lines into closed form models (i.e. coupled transmission lines) which greatly speeds up the analysis. With a bunch of curves, you can’t do that, and it has to break those out for EM analysis.
If one could easily make square via holes in PCB, those would be preferable for situations like grounding vias as they better terminate the EM wave.
She got the hell out of microelectronics and is now a data scientist. The former is a dead end job in the USA and the latter pays better.
The same can be said for physicists and mathematicians who know just enough EE. As a practicing EE who specializes in RF and antennas, I've had to debunk many crackpot antenna and circuits, who developers are looking for funding. The nice thing about RF is hunks of dielectric and conductor are pretty easy to fabricate or simulate, but they don't even try to prove their ideas.
Same with USB-UART bridges; zip, nada, nothing. I found some Cypress parts a few weeks ago, and I should consider myself lucky.
I won't order PCB until I have all reels of parts on my desk.