1,568 karma · joined January 3, 2013
Considering the age of the chip, the masks are probably not even available in a digital format and the fab that made it had been shut down a long time ago. Recreating these processes is a massive undertaking that takes a lot of manpower.
That's the only answer.
Curious. So assembly optimization does not really help that much with modern CPUs?
First project Tango smartphone will be out soon.
Let Elsevier go down in flames. I have published more than 50 academic papers and have actively avoided Elsevier. To be honest, this was not too difficult, as they have a lot of journals addressing specialized subtopics that rather seem to appeal to manuscripts that were rejected in first tier journals.
Even in the western world, I am not aware of a single example where a religious community is funding research without taking influence and without using it to advance their own goals. There surely is no shortage in dubious research institutes funded by christian sects or even more moderate entities.
There is little disagreement in the scientific community about keeping science separate from religion and preferrably even the state.
I like it. It is raw and functional.
- why does "return" eject the card?
- You would more likely get a card as a return. Because that's basically what the computer did back then - sort cards.
Lets just forget about this "memristor" PR-nonesense. HP did as well. (Their activities seem to be dead)
This way I know that it is sufficient to read the first paragraph.
Lack of branding is still a brand...
Is this really a discussion worth having? How is it different from the last one?
ICs are made of monocrystalline silicon, not polysilicon. There have been massive efforts to understand how to make it cleaner (internal gettering) and how to get wafer mechanics under control (Nitrogen doping). That does not even touch the changes in production technology to go from 10 mm Wafers to 300 mm Wafers. (You just make them larger, right...)
A lot of new concepts and materials have been introduced to ICs during the last decades. Especially since the 130 nm ground rule, lithography has not been the main limiter. Examples: Copper, Tungsten, Diffusion barriers, Silicide, Strained Silicon, High-k, metal gates, finfet, 3d integration etc...
The only constant is probably that it is still made on a silicon wafer. But even this wafer changed a lot, and I am not talking about its size.
Would you also compare a horse carriage to a Tesla?
It is the largest.
Why would any affluent techie buy a Ferrari?