992 karma · joined December 7, 2023
In short, cheap energy might be the culprit but I don't know for sure.
I don't see a thermodynamic problem here. Noise modulation with switching is well known in electronics. Switched resistors and their noise is already analyzed. It is often in the context of noise parr of SNR though. They are using this noise modulation to transmit signals, which isn't too novel. I guess the transmit power is very low but this would be horrible for Shannon spectral efficiency because of the need for noise power detection, which cannot be instantenous.
These round structures are intriguing. It's thought to be temporary. People came from all directions, built these, stayed for a while, ate a lot of hunted animals, and they buried these structures to never use again. Why? We don't know.
I should visit Karahantepe too. Looks as interesting.
Try eating wholegrain rice.
On top of this, once European giants like NXP (formerly Philips semiconductors), Infineon (formerly Siemens semiconductors), and ST are actively reducing their footprint in Europe and moving to India or SE Asia.
In short: No, EU has no future in those markets as designer or producer of chips.
I'm an EE with main expertise in IC design but I design a lot of the chip packages, PCBs, mechanical stuff like custom made sockets etc and write a ton of SW, be it tools for myself for development and testing, be it the firmware of the chip I'm designing or another chip I use on the board. For me it never felt like SW was the hard bit, because you can write and test it pretty immediately and pretty much for free. HW felt harder because of the tooling costs, lack of documentation and examples, things that aren't obvious at the beginning (EMI/EMC) etc etc but these are very minor compared to the actual issue: long and expensive development cycles. Now, that doesn't apply if your HW is extremely simple and just a glorified uC and rhe development time is mostly the code running on it. This is why this is such a poor take. One can argue for anything at extremes. SW can be very very complex and much harder than HW, and vice versa at different extremes.
I suspect this is because of its CPU, Intel Core Ultra 7 258V with 32GB RAM directly soldered on the CPU package, being overstock or something, or Intel secured the RAM supply upfront. I don't know but it's wild that this laptop is still early 2025 prices.
The solder joints are notorious to fail at a high rate too.
Nowadays even start-ups are paranoid and starting a semicon company is orders of magnitude harder..
I understand most cultures over-appreciate meat, but treating a premium carb source like rice lowly is a surprise.
It's very common to xray the dies, especially for debugging. Also common is to etch it layer by layer, take photos and rebuild the circuit schematic, mainly for reverse engineering but I've seen companies doing it to their own dies too.
Things get more blurry at the board level, the combinations of suppliers and service providers are endless.