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Comment by lightedman | Hacker News Reader

Nothing new, Applied Diamond has made this stuff for several years and it is incredible. Imagine putting a 15w LED on a typical 20mm star board made of diamond - you do not need a heat sink. Just minor air flow over the package is enough.

A little unlike IEEE to be nearly half a decade out of the loop.

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I think what they have grown diamond on the transistor which then bonds to the substrate through a SIC interlayer.

From what I understand their idea seems to be that since most heating occurs at channels they act like hotspots and therefore it would be much better to drain away heat from them directly.

This is different from creating transistors on a diamond substrate.

The invention is a fast, low-temperature deposition process, which can then be used directly on a semiconductor device.

Diamond Foundry achieves the same end goal even if the deposition methods and technical processes may differ: https://df.com

They produce the diamond wafers separately and then later bond them, a process that is dramatically more expensive and results in a worse bond.

The new thing here is growing a thin layer of diamond directly on top of a chip.

naturally, graphite has similarly high thermal conductivity along the layer direction (which is basically graphene), and one would think that there should be some way to put such a thin layer of graphite/graphene on top (or inside) the chip to achieve similar results.

Would the electrical conductivity be an issue?

On a printed circuit? Nah. Can't imagine why it would.

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