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If this can be scaled up, I wonder how useful it would be for use in space for radiative cooling - clearly, you can see I’m thinking of diamond skinned space-craft hulls - how cool is that!

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I think cooling in a chip vs cooling in space are two orthogonal problems. In a chip, the problem is getting the heat to the heatsink where it can be efficiently dissipated into the much larger heatsink of the surrounding environment. In space, the problem is that the only way to dissipate heat is thermal radiation because you're in a vacuum.

> only way to dissipate heat is thermal radiation

Well, besides ejecting the heat as propellent (probably water?).

Thermal radiation is probably the best way, propellent runs out eventually.

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