I like it. I've used sandpaper to solve some interesting problems in the past as well with great success. I suspect we are only seeing the beginnings here in a trend of high-tech applications of fine grit paper.
You could still compare the internal structure of the package and bonding, but the die itself is mostly destroyed.
https://phillipscorp.com/india/phillipsgrinding/phillips-sur...
All you need is a serial port and some G-codes.
https://www.youtube.com/playlist?list=PLDlWKv7KIIr9rlCwZ9K43...