I wonder what it would cost Apple to recreate ASML.
For china it's DUV+packaging for now, NIL/DSA mid-term, and MoS₂/2D chips long term. But wafer scale, defect free 2D logic is 20–30 yrs out, so no EUV shortcut anytime soon
And SMIC is a decade or less behind without any of that.
China isn't quite there yet, but they will catch up. The question then becomes whether China can surpass the west or if they're stuck in lock-step behind us.
I don't know enough about chips to say whether any of these numbers make sense.
Those numbers are realistic. EUV is the most complex machine ever built by humans