https://www.reuters.com/technology/new-us-rule-foreign-chip-...
Absolutely majority of IP in this field belongs to intel, IBM, KLA and Lam research. Everyone else is a licensee. This is one of the reasons us and allies are desperate to keep bailing out intel, or get it acquired by another american company.
I'm not sure why European countries signed this deal, given that the US still started trade wars a few months later. Maybe they had more faith in the American electorate than they should've had.
U.S export controls have a foreign direct product rule. If your product directly depends on US IP/tech then US export controls apply to you too. ASML's EUV machines depend on a lot of U.S ip and tech. These range from patents from the EUV consortium days, all the way to today where a lot of the components are designed or patented by the US (intel, ibm, applied materials, lam, KLA, [1]). Thus, export controls apply whether netherlands likes it or not.
In EUV litho, the strategic I.P - and what IP is a strategic chokepoint is subjective, so IMHO - is 50% EU, 40% U.S and 10% Japan. More than enough for FDPR.
See ECCN 3B090 (2022) for lots of extra restrictions placed beyond this, specifically targeting semicon manufacturing exports to PRC, such as the presumption of denial clause.
[1] and cymer. Altho they were acquired by asml their IP remains san diego based aiui.
For china it's DUV+packaging for now, NIL/DSA mid-term, and MoS₂/2D chips long term. But wafer scale, defect free 2D logic is 20–30 yrs out, so no EUV shortcut anytime soon
China isn't quite there yet, but they will catch up. The question then becomes whether China can surpass the west or if they're stuck in lock-step behind us.
And SMIC is a decade or less behind without any of that.
I don't know enough about chips to say whether any of these numbers make sense.
Those numbers are realistic. EUV is the most complex machine ever built by humans