Obtaining a custom storage module seems to involving reverse engineering the PCB, printing it and sourcing the NAND modules, and then BGA soldering that all together:
https://youtu.be/HDFCurB3-0Q
Not a user-friendly process, I think.
Not a user-friendly process, I think.
They are the same course, imo. That it's been done in this way is typical behaviour we see from them, but expected/unsurprising behaviour does not necessarily make it a justification.