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I managed 1μm/minute when electroplating PCBs at home.

Faster and it grows a sponge of copper (entrapped gas I assume).

I would like to know how they did it.

Seems like even in a vacuum it could still make a metal foam, but perhaps would help minimize defects?

That's just PVD or CVD, which does massively decrease defects but being a gaseous process slows down growth considerably.

Parallelization? As in you grow layers upon layers in parallel, align them and chemically bond them?