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Image comparing the processes: https://global.canon/en/news/img/2017/p20170720b-02.jpg

Deposition is usually the same -- CVD.

Note that the stamp is applied to the resist:

> the new product does it by pressing a mask imprinted with the circuit pattern on the resist on the wafer like a stamp

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But the process looks more messy, for example, how do you clean the wafer? Or how do you prevent the resist from getting stuck in the wafer?

Do they get high yields with this technique?

How does any of this stuff really work? It seems as close to magic as I can possibly imagine, the idea that the laser source alone for EUV lithography fires a laser twice at single tiny droplets of falling tin, once to turn the droplet to tin plasma and again to generate the right wavelength of light, all in a fraction of a second, and this happens at up to 50,000 times per second. Seems mad to me...

My reading comprehension failed me, thank you for finding that image. That explains it alot better

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