Chiplets are the microservices of the semiconductor world. It’s good in that smaller individual chips are cheaper to produce, and the whole package is more scalable, but it’s bad in that there are interfaces that reduce performance vs a monolith
Consider AMD's approach. They use multiple CPU dies in a single package to build very high core count systems that would previously have required multiple sockets. Bringing these into one package can make communication more energy-efficient and faster, as well as simplifying other aspects of the system. They also use different processes for different dies. The "IO die" is fabricated on a slightly old process as it is not performance-critical while the best process is reserved for building cores.
Microservices are supposed to improve testability, reduce complexity, etc: it is an organizational choice. Chiplets add complexity: silicon interposer, tougher packaging, NUMA, etc: it's an engineering choice with a tradeoff for better yield, chips reaching maximum reticle size, etc
trust boundaries
open vs. closed IP
old vs. new processes
onshore vs. offshore
supply chain resilience