Its weird to say that datacenters 'didn't see it coming' when every chip produced in the last few decades has relied on smaller process nodes to increase performance/watt/silicon-area at the cost of increased power density. Theres no good way around the power density so the first company that can integrate advanced active cooling features in chips themselves will have an advantage as cpu's are already hitting their tdp limits with your standard behemoth cooler unable to outscale the power density.