There's a lot coming down the pipe in term of next-gen components in the SOI and 3D subthreshold world, ULP (ultra-low power), MEMS (pretty much everything you find in your phone these days, outside of the CPU itself), 3D integration, the problem is summarizing it in a neat little comment. Memristors are huge, and are going to be, huge-er still. World changing huge. Which ties in to new analogue design techniques. 3D integration, which we have had for a decade, is at the tipping point as we move to new nodes and start making monolithic integration a thing. Ultra low power energy efficient compute at the edge, we're talking consuming less power in a year than it takes me to think about what I want to say when writing this comment right now. On-die microfluidic cooling for 3D dies is starting to appear. On-die sensors for new camera tech. We're edging up to a point where multiple sensors and/or a camera, compute, model inference and mesh network connectivity all exist on a single die.