Also, DUV equipment is about to become restricted for sale to China, which means they can’t scale the fabs.
If they have enough spare capacity from building supercomputers and military chips to make bitcoin ASICs they are probably already at a good scale.
I wonder what SMIC's contingency plans are for this. China is going to need to move into the semiconductor equipment space.
> 7nm FinFET plus (N7+) technology entered full-scale production in 2019 and delivered customer 7nm products to market in high volume. N7+ technology is the first commercially available extreme ultraviolet EUV-enabled foundry manufacturing process
https://www.tsmc.com/english/dedicatedFoundry/technology/log...
It looks like there was a 7nm SRAM process in 2016 that only used DUV, but I'd be surprised if more than, say, 1% of "7nm" mentions over the last few years were intended to refer to the 2016 process rather than the 2019 process.
According to Wikipedia: https://en.wikipedia.org/wiki/7_nm_process , mass production with N7+ which uses EUV was ramping up from 2018 to 2019. It seems that the Apple A12 as well as some Ryzen chips were using the N7 DUV process.