It seems like TSMC building a US based foundry may become a mitigating factor.
The TSMC fab in Phoenix is build for 5nm and will open in 2024. The TSMC 3nm process should go into mass production in 2023, it is expected that the 2023 iPhone will use a 3nm SoC. The fab will only produce 20k Wafers per month, the TSMC gigafabs in Taiwan produce 100k Wafer per month each.
Details about TSMC Phoenix fab: https://www.cnbc.com/2021/10/16/tsmc-taiwanese-chipmaker-ram...
Thanks for your assessment on this. Would you please share how you arrived at one year of a product sales gap?
Do you think it is possible for the US to bring 3nm process to the US while that is still relevant?
What planned or potential pipeline of other new non-Intel chip fabrication plants on US soil do you foresee?