IBM: New heat-dissipating glue will allow 1000x processor speedup via stacking

With all the 1000x time speedups that IBM releases I'm amazed that we have to wait for computers at all, no matter what the task.

I really wished that these announcements would be at least accompanied by working prototypes showing the main claims in a realistic setting.

Since these are all things that may (or may not) be realized in the distant future when those reading the article will have long forgotten about it or will be safely deceased I suspect they are more of a marketing ploy than a true announcement of a breakthrough.

See the comments on the press release here: http://news.ycombinator.com/item?id=2981939

(which is now dead)

Basically the bogosity here is that while its cool that the glue can act as a heat spreader, the heat still has to go somewhere. This has been a bigger hindrance on 'stacked' silicon. How do you pull 250 - 500 watts out of a chip efficiently. Its a very hard problem. If you have good chops on how to do this you can make a mid six figure income designing power stages for fighter jet radar units.

While I am as dubious as the rest of you about how likely we are to actually see this, I appreciated learning that adhesives are one of 3M's 46 core technology platforms. Does anyone know what the other 45 are?

I get the feeling that researchers and manufacturers always wait until we're close to falling short of Moore's Law to come out with advances like this. I guess they can push quantum computing back a few more years now.