Agree. I've seen 10+ variations of this over the last 20 years and they've all lead to dead ends, fireballs coming off wafers and 12 inch long heatsinks (HP PA-RISC for example).

The miracle solution is change the way we do things rather than rice up our existing architecture.

Nobody is asserting that it has zero thermal resistance, or that the stack will have zero thermal resistance. Only that it may have adequately low thermal resistance.

Random people on the Internet calling "bullshit" isn't how science works. Whether or not they are able to produce results is the only thing that matters.