It's designed for sub-zero overclocking (thus, the name), and has thinner siblings, but I chose it specifically how thick it is, and how it has no curing time. Sub-zero overclocks has the worst pump-out effect due to the vast range of temps you can travel.
The pump-out on my MBP with stock paste was absolutely absurd (hardly any paste left on the dies, almost entirely shoved to the very edges of it), but given the past year, it has had less thermal degredation than my tube AS5 historically has (which is near-zero, I just have to repaste it every 5-8 years, or "once per life of device").
Apple's own paste didn't survive 3 years, or basically went to shit right after Applecare ended. Suspect this is on purpose, but, obviously, can't prove that.
Edit: By the way, thicker pastes require a little bit more pressure to get good contact. I suggest everyone get a torque screwdriver that can be set to 0.6 Nm/5-6 lbf to screw their heatsink retaining screws on.
Intel and AMD have pretty consistent recommendations, as do GPU manufactures, and they range from 0.8 to 1.2 maximum. 0.6 is enough to not risk overtightening, and is also enough to make thicker pastes happy; 0.6 is also Noctua's universal recommendation.
Also, Arctic Cooling's MX4 is another popular thick paste (usually for GPUs, not CPUs, seems to be more consistent on large dies) that likes high pressure mounts.