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Haswell had an on-die, integrated voltage regulator. I guess it didn't work as well as expected because they removed it in Broadwell.

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It was removed in Skylake, not Broadwell. Ice Lake reintroduces the FIVR again. The inductors are now in the package substrate (rather than discrete inductors on the package or the weird 3DL module in Broadwell-Y) and efficiency at low power is improved. The latter is obviously extremely important for mobile workloads.

Do you see integrated super caps or batteries into the package or die at some point?

Not on die, but on a separate module on the substrate. Very different thing.

They still use FIVRs on mobile chips, except they managed to put inductors in the substrate now

It's on die. On the Haswells with two dies, the second one was eDRAM.

https://www.psma.com/sites/default/files/uploads/tech-forums...

No, no, no. Haswell inductors are off-die, that's what that very paper says.

What Intel was saying is that they had an on-die industrors ready in labs, but never stated if they are going into production.

Inductors are not the important part, it's all about the MOSFETs

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