I started wondering about the physics of removing 280W of heat from the tiny silicon die/dice. Is most of the heat conducted through the metal connections or through the package? What material is the package made of?
You can see how the dies themselves are laid out here: https://images.anandtech.com/doci/15151/amd_rome-678_678x452...
And you can see how physically huge the package is here compared to desktop CPUs you may be more familiar with: https://images.app.goo.gl/T5kpz8WyjGHV8Vqm8
The lid is made of copper and as you see there are additional layers. Plus the interfaces between the materials are also limiting thermal conductance. As far as material science goes there's a lot of room, it's just not practical to throw liquid nitrogen cooling or diamond substrates at the problem when you're making a mass market product.
With "280 watts" you can still use an off-the-shelf Noctua air cooler or any number of all-in-one water coolers.