Unlocked multipliers don't mean you've chosen the optimal multiplier. And something binned for higher clock rates doesn't necessarily mean it runs cooler at the same clock rate as another part. As others have mentioned, thermal management is a real issue here. A throughput benchmark doesn't care about brief bursts of speed, but rather sustainable rate.
Finally, even with identical parts, the assembly can affect performance. The same heat-sink installed slightly more effectively in terms of the mechanical interface (no contamination, just the right amount of heat-sink compound, no air bubbles) will allow the chip to run at higher power without any thermal throttling.