This is just such a dire situation to be in. Even USA has seen the writing on the wall regarding China-Taiwan which is why it has been strategically re-homing all the most advanced chip fab technology to Arizona [1].
This is just such a dire situation to be in. Even USA has seen the writing on the wall regarding China-Taiwan which is why it has been strategically re-homing all the most advanced chip fab technology to Arizona [1].
If you have a two step problem, the strategy of "I can't do two things at the same time so I'll just give up", is not a good one.
While bleeding edge backend processes got the bulk of reporting, the major push for the American CHIPS Act was the rebuild packaging capacity in the US (Samsung is working on this in Texas).
This was also the same approach Taiwan, Malaysia, and China used to climb up the semiconductor value chain.
The EU also failed to tie design capacity together as well, as semiconductor design capacity is almost nonexistent in Europe.