A lot of the AI progress is stalled because these chips do not handle thermal contraction/expansion well at all, and end up permanently destroying these chips. HBM has been a failure at this scale with chips getting destroyed every 4 months or so during operations.

I'd like to see some actual science saying, here was the problem, here's how we solved it, here's the AFR data, here's this running after X cycles etc. Nobody has done this reliably yet. That entire industry is hiding the bodies.