Other fun chemicals used in fabs were Silane (CSi4), methane w/ silicon instead of hydrogen, used to form a silicon dioxide layer for etching* w/ HF and final step of protection. It would spontaneously combust on contact with air, so when you popped a tank fitting it would leave a white powder residue. Silicon dioxide is used as a food additive so AFAIK that wasn't dangerous.
Phosgene was also used as a dopant. If the alarm for that went off you really got out ASAP.
Arsine was a dopant also.
This is what I sort of remember from working on slacker job in silicon fab a long time ago when the number of transistors per chip was 1. I did say a long time ago.
* You could also just oxidize the outer layer of the silicon wafer itself w/ water vaper at high temps.