The article mentions, but doesn't explicitly state, that they're going to be using electron beam lithography. Makes sense for their low volume and/or prototype fab goal, but I'm curious how well that would work for prototyping to fab at high volume with the likes of TSMC or Intel.

I would assume that re-targeting a design to a different fab's process would change enough about it that you might as well just do verification in simulation rather than sidetrack through Fab2.