China Tells Telecom Carriers to Phase Out Foreign Chips by 2027 (2024)
wsj.com
wsj.com
> China’s industrial policy has gone fully vertical, funding every layer from photoresist to processor. Big Fund III, a $47.5 billion state vehicle that began deploying in 2025, prioritizes the weakest links: lithography, fab equipment, and design software.
https://pantheoninsights.substack.com/p/chinas-chip-making-c...
> China sales for Japan’s top five chipmaking equipment suppliers fell 10%, a first-time decrease. This suggests a significant change in the global semiconductor landscape, more than Western news reports indicate. It is not just about US export controls. It also reflects Beijing’s accelerating success in building up its own domestic companies. Western media often describes China’s chip self-sufficiency as a response to US pressure, but the situation in China and Japan is more complex.
> For China, this sales decline confirms its strategy is working. Reports from Beijing and state media highlight the growing strength of companies like Naura Technology Group. This shows real progress in replacing foreign reliance with homegrown capabilities. China’s focus on domestic production is not new, but the data now show it is effective, even in sophisticated equipment sectors where Japan has traditionally led. Chinese industry leaders openly express optimism, seeing current conditions as a way to boost their own innovation and market presence.
https://asiaai.fyi/japans-ai-shift-chip-woes-automation-hope...
> Huawei Technologies said on Monday it will make industry-leading semiconductors using a new technology in five years, underscoring Beijing's efforts to neutralise U.S. sanctions that have made it hard for China to build cutting-edge chips.
> Huawei, in a semiconductor symposium in Shanghai, said its high-end chips will have transistor density equivalent to 1.4-nanometre processes by 2031, but did not provide independent performance data.
https://www.reuters.com/world/asia-pacific/huawei-proposes-n...