Do we have any explanations of what WLCM means that are more industry focused? I couldn't find anything that didn't look like blogspam. And that explanation of the DRAM being on the same wafer doesn't really make sense. For one, at that point there's no "multi chip" part if you're integrating more onto the same die rather than less.

And their explanation isn't really passing the smell test for me for other reasons, for instance the fact that DRAM processes are pretty radically different than bulk logic processes, which wouldn't really let you put it all on the same wafer, much less the same die. Even back in the day when you had eDRAM blocks (like the Xbox 360's eDRAM die), that was really a DRAM process with a bit of logic cells that wouldn't be competitive if they weren't sitting right next to the DRAM blocks.

I could be wrong here though, my examples are more than a bit long in the tooth.