You're thinking 2-dimensionally ;-)
Our future CPUs should be tiny cubes, not flat chips.
Distance to each point in 3 dimensions is shorter.
Our future CPUs should be tiny cubes, not flat chips.
Distance to each point in 3 dimensions is shorter.
Now turn them sideways, so they rest on the edges. Put the stack in a small ceramic container with copper bottom and top. Fill with a high efficiency thermal transfer fluid, and make sure the convection currents flow properly.
There you go, small matter of engineering.