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Comment by VWWHFSfQ | Hacker News Reader

It looks like it's still a big difference between how the US and EU are responding to the chip supply wars. The US is actually building their own manufacturing capabilities domestically while the EU is apparently doing nothing, which is unfortunate.

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There is https://www.ferroelectric-memory.com/memory-chip-factory/

There is also https://www.vishay.com/ which expanded several sites in .de, without much fuss, or begging for subsidies. That is neither RAM, HBM, NAND, nor NOR, but nonetheless much needed stuff, for all the electrified cyber.

Infineon is _opening_ its fab plant in Dresden this year which was supported by around 1bn euros from the EU equivalent of the CHIPS Act. They started building this fab in 2023, while TSMC, who started building its fab in the US right after covid just delayed the opening to 2027

The fab that Infineon is building is vastly smaller in scale, and their tech isn't really relevant to this discussion. For instance, it doesn't produce CPU/GPU microchips or DRAM. Also only 300mm wafer technology, which isn't competitive for anything except for some narrow industrial use-cases. Glad to see the EU is doing it, but it's a completely different thing.

Pretty much everyone is on 300 mm wafers for everything now, and has been for a while. Are you perhaps reading this as 300 nm process (which would usually be called 0.3 micron)?

But in the context of what we are talking about it's still true that nobody in the EU is making cutting edge CPU/GPU/DRAM and there are no plans to do so either (including that Infineon fab).

https://www.ferroelectric-memory.com/memory-chip-factory/

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