Very wide SIMD instructions require a lot of die space and a lot of power.
The AVX-512 implementation in Intel's Knight's Landing took up 40% of the die area (Source https://chipsandcheese.com/p/knights-landing-atom-with-avx-5... which is an excellent site for architectural analysis)
Most ARM desktop/mobile parts are designed to be low power and low cost. Spending valuable die space on large logic blocks for instructions that are rarely used isn't a good tradeoff for consumer apps.
Most ARM server parts are designed to have very high core counts, which requires small individual die sizes. Adding very wide SIMD support would grow die space of individual cores a lot and reduce the number that could go into a single package.
Supporting 256-bit or 512-bit instructions would be hard to do without interfering with the other design goals for those parts.
Even Intel has started dropping support for the wider AVX instructions in their smaller efficiency cores as a tradeoff to fit more of them into the same chip. For many workloads this is actually a good tradeoff. As this article mentions, many common use cases of high throughput SIMD code are just moving to GPUs anyway.