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> AMD's X3D CPUs have a single SRAM die stacked on top of the regular CPU+SRAM, with TSVs in the L3 cache to connect to the extra SRAM.

Just FYI, the latest X3D flipped the stack; the cache die is now on the bottom. This helps transfer heat from the compute die to the heatsink more effectively. In armchair silicon designer mode, one could imagine this setup also adds potential for multiple cache dies stacked, since they do interpose all the signals, why not add a second one ... but I'm sure it's not that simple, for one: AMD wants the package z-heights to be consistent between the x3d and normal chip.

The issue is size, SRAM is 6 transistors per bit while DRAM is 1 transistor and a capacitor. Anyone who wants density starts with DRAM. There’s never been motivation to stack.

I agree with your description and conclusion. Additionally the companies that can make chip stacks like HBM in volume are the HBM manufacturers. As they are bottlenecked by the packaging/stacking right now (while also furiously building new plant capacity) I can't see them diverting manufacturing to stacking a new SRAM tech.

Every time I read about D|S-RAM scaling I'm reminded of https://www.besang.com/

Ever heard of them? What do you think? Vaporware?