Perhaps I don't understand something so clarification would be helpful:
I was under the impression that Apple's RAM was on-die, and so baked in during chip manufacturing and not a 'stand alone' SKU that is grafted onto the die. So Apple does not go out to purchase third-party product, but rather self-makes it (via ASML) when the rest of the chip is made (CPU, GPU, I/O controller, etc).
Is this not the case?
https://upload.wikimedia.org/wikipedia/commons/d/df/Mac_Mini...
That whole square is the M1 package, Apple's custom die is under the heatspreader on the left, and the two blocks on the right are LPDDR packages stacked on top of the main package.
https://wccftech.com/apple-m2-ultra-soc-delidded-package-siz...
Scaled up, the M2 Ultra is the same deal just with two compute dies and 8 separate memory packages.
Even lower end GPUs are getting more expensive even if they are not really useful for AI. But they still contain <some> chips and ram which is in high demand.
So yes, Apple will likely also have to pay higher priceses when they renew their contracts.