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That’s true, but Zen1 TDP is a lot higher than an RPi. Hitting that level of performance in a power and heat envelope that works for a Pi probably demands a smaller process node, unfortunately.

I think it will split between TSMC (sold out forever) and Samsung/Intel (please please be our customer).

Fun fact: only five high-NA EUV Machines have ever been delivered.

> The world is probably going to be split between EUV and non-EUV lithography for a long time.

How long before China develops indigenous EUV capability?

>> How long before China develops indigenous EUV capability?

Oh, they absolutely will. I meant the tech world though, not the geopolitical one. Other node will also linger since there are cost differences, but EUV is going to remain a big cost step from 14/12.