The question is when price/performance hits financial limits. That point may be close, if not already passed.

Interestingly, this hasn't happened for wafer fabs. A modern wafer fab costs US$1bn to US$3bn, and there is talk of US$20bn wafer fabs. Around the year 2000, those would have been un-financeable. It was expected that fab cost was going to be a constraint on feature size. That didn't happen.

For years, it was thought that the ASML approach to extreme UV was going to cost too much. It's a horrible hack, shooting off droplets of tin to be vaporized by lasers just to generate soft X-rays. Industry people were hoping for small synchrotrons or X-ray lasers or E-beam machines or something sane. But none of those worked out. Progress went on by making a fundamentally awful process work commercially, at insane cost.