The red ring is caused by underfill that is too soft that let's the solder bumps break. It's a BGA packaging problem and there's no fix.
The core is EU's regulation on lead free solder, which led to a number of people finding out that thermal cycling on the solder led to thermal stresses. Workarounds were identified and any solder formulations since then don't suffer from that issue, so the fix is a complete re-balling of affected chips... a work not for those faint of heart.
Many had no issues, but a few companies didn't bother to do their homework, problem would have been the same if the period was twice as long.
At this point, the directive may have caused more e-waste and environmental damage from part failures than the damage the original leaded soldier would have caused.
Lead: The most extensively spread toxic environmental contaminant (2024): https://www.sciencedirect.com/science/article/abs/pii/B97803...
The Urban Lead (Pb) Burden in Humans, Animals and the Natural Environment (2022): https://pmc.ncbi.nlm.nih.gov/articles/PMC8812512/
“May” is doing a lot of work there. Can you substantiate the claim that the risk of lead is lower than the switching cost?
The problem is where the e-waste ends up - some ditch or desert in Africa. From there it ends up leeching in the environment due to corrosion or, worse, as widespread aerosols when the people there burn the waste to get to the copper.
Technically you could recall and repackage the dies but you'd need millions of dollars in equipment.