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I would think you’d want to make them out of something crazy like diamond or titanium carbide. What did you make yours out of?

Came to the comments to see this. Stamping has all sorts of problems with alignment, stamp resolution, contact quality, etc, it's not clear whether this so called "simplicity" still holds after scaling up the resolution even more.

Wasn't this sort of how Intel got started in the 1970s? Some kind of contact printed ICs?

You're probably thinking of contact lithography, where a 1:1 mask is placed directly on the wafer and illuminated. This would've been used for the earliest IC processes, where you'd still be able to see the structures with the naked eye or a loupe.

That is basically like home grown PCB but at very tiny.