In the future they will probably be packaged in the US: https://www.apple.com/newsroom/2023/11/apple-announces-expan...
In recent times, multi-chiplet architecture has added its own layer of complexity to that process.
See also: OSAT.
1. The output of a "chip manufacturing" process is a wafer. There is absolutely further assembly (bonding, packaging) done on this output.
2. The chips themselves are not for the end user's consumption. They are assembled into a product, a "consumer electronic".
We've had to ask you this before (https://news.ycombinator.com/item?id=35998957), so if you wouldn't mind reviewing https://news.ycombinator.com/newsguidelines.html and taking the intended spirit of the site more to heart, we'd be grateful.