I get the feeling it wont be testing and packaging where testing is heavy duty metrology, characterizing silicon, inspection, defect analysis, binning. It will be packaging and testing of packaged chips with press button to receive bacon machine.
> Zakład integracji i testowania półprzewodników Intela
This translates to "Intel's semiconductor integration and testing plant". So it looks like it'll be more than just testing finished product, but we'll soon find out anyway.