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This is the future. As we try to go 3D and start stacking dies, the limiting factor of heat is getting even more blocking.

It's not about consuming less electricity. It's about dissipating less of it as heat inside the microprocessor. The future will made of tiny porous cubes that are tall sandwiches of RAM and CPU/GPU/etc

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Superconductivity with current materials is hard. Allost always because of the cooling. You can't just fabricate a porous cube of transistors and put it in a liquid helium ice bath. You need to have excess heat flowing out in a stable and predictable way. Otherwise once the center reaches critical temperature, the whole thing will explode. There's a reason why everyone is desperately searching for room temp low pressure sc materials. I doubt we'll see industry applications in large scale computing before that.

Totally true, but it’s interesting that this technology lends itself to incremental improvements. And those improvements can be driven both from the hardware side and the software side. It seems like a virtuous cycle driving this to economic viability and optimization is possible. I’m no expert, though, so this is strictly my imagination.

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