Why not hexagons?
When silicon area is expensive and performance can be maximised by reducing average on-die wire length, hexagons sound like they might make sense.
Obviously current layout tools prefer X-Y area splits, so a lot of tooling would have to be redesigned to make use of a probably rather small performance gain.
Wouldn’t they contaminate the just fabbed silicon surfaces? (That being said i have no idea how swarf is typically managed in die cutting.)
But it breaks too much of the existing flow to be worthwhile