RepRap printed circuits
blog.ponoko.com
blog.ponoko.com
It might be straightforward to optimize the number of needed stations to "print" a reasonably-sized PCB that's fully populated and ready to use, though. Particularly if some stations could be combined due to similar hardware and precision needs: drilling vias and mounting holes could be done with almost the same hardware as pick & place. But full self-assembly will be orders of magnitude more difficult because of the need to move through several stations, potentially with manipulation in between. There you're getting into essentially small-scale factory design.
It'll be awesome when it happens though: An assembler that can autonomously create, "from scratch" (only basic components), another fully-functional assembler. That can create, "from scratch," yet another fully-functional assembler.
Just, uh, don't go combining all that with mobile resource foraging and extraction and an imperative to keep making copies.
In 1963 Australians Bolto, DE Weiss, and coworkers reported iodine-doped oxidized polypyrrole blacks with resistivities as low as 1 ohm·cm. This Australian group eventually claimed to reach resistivities as low as 0.03 ohm·cm with other conductive organic polymers. This resistivity is roughly equivalent to present-day efforts.
Sure we are.. http://code.google.com/p/homecmos and irc.freenode.net ##hplusroadmap says hi.
But I can dream, right?
One of the goals is a solar cell production plant design that MetalicaRap will be able to print, that will utilize MetalicaRap's vacuum chamber and beam for the solar cell manufacturing processes. For a typical family home electrical system we may bring the solar cell cost down from 10,000 euro to 400 euro by self printing. (solar cell installation, inverter, and other costs would obviously be on top of this price).
It should be possible to use a process that creates thin film solar cells at a vacuum of 10-4 Torr by directly co-evaporating copper, gallium, indium and selenium onto a heated substrate[3]. Other precursor choices should also be possible[4]. The CIGS manufacturing process will consist of electron beam physical vapor deposition[5] (EBPVD summary by material [6]) and DC sputtering in the vacuum chamber(DC sputter animation [7]).