X-Ray Inspection in the Semiconductor Industry
semiengineering.com
semiengineering.com
But this is now essential tech for "end users" too, to assure supply chain provenance from tampering and implanting of malicious VLSI.
I first heard of the work of Andrew "bunnie" Huang [0] here on HN, and the ability to inspect with near-IR radio instead of more difficult and dangerous X-rays.
I look forward to the day I can borrow or hire an electronics "hand scanner" microscope and verify that Intel hasn't quietly popped another backdoor "management engine" into the board I bought.
How I imagine this working - Huang and Applebaum both suggested similar - is that someone would publish "ground truth" templates of what hardware should look like. The validation would only flag suspicious differences (using "AI"/pattern-matching etc) and then those would definitely be escalated to an expert.
For metal/bump voids, hard to inspect any other way
The harder problem for X-ray inspection is that 1) resolution is difficult to scale economically (possible, but hard). And 2) if any version of wafer or die direct bond dominates (I tend to believe it will), then x-ray won't be good enough anyway, so hard to spend the investment on this.
The modified circuits are not very stable, so it can only be used to verify a fix.
(I learned this 20 years ago, not sure if it still a thing.)
der8auer on YouTube also did an even more in depth video on the nanoprobing, at least, and there are a couple places showing the process of etching with electron beam, but not with a very good explanation.
Even more interesting is mask level overlay and CD correction using ultrafast absorption based stress fields. There are some heat technologies out there