Frankly this is aimed more at XMP, where vendors routinely bump IMC voltage to get those swanky binned gaming kits onto the QVL. A ddr4-4800 kit obviously isn’t going to work on stock voltage with a memory controller rated at 3200, the gap is covered by increasing VCCIO and VCCSA a lot, and this results in quite a few chips with failed memory controllers over time.
Also, on AMD there is an extremely widespread culture of overclocking the fabric which again, can result in degradation over time (progressively lower clocks at a given voltage, or instability at a fixed clock). People very much still believe in the fairy-tale of “24/7 safe” overclocking - obviously the manufacturer has every incentive to certify the chip as fast as it’ll go, they set the limit at the 24/7 safe point already, but the gains are so potent that people tell themselves whatever they need to hear.
https://www.amd.com/en/legal/claims/gaming-details.html
AMD and intel have been very very clear for a very long time that this is not covered by warranty (see AMD GD-106/GD-112) but people have low key continued to do it and warranty the CPUs when they fail, because there wasn’t a way for AMD and intel to tell. And to be fair - AMD and intel have often muddled the waters by using these numbers in their benchmarks etc. But there remains a general sense of “if you didn’t turn on XMP you didn’t do the build right” and “XMP can’t hurt anything as long as you don’t increase the voltages” despite this already being done automatically by the board.
XMP absolutely does cause damage and I killed a 9900k with no other overclocking simply by enabling XMP on a fast kit. But consumers still don’t get the memo, they think it is only a problem if you instantly blow up the chip like the 7000 series at launch. XMP is widely viewed as safe and even something you're supposed to be doing.
Electromigration happens very quickly at 7nm and 5nm nodes, and people are not used to it, and it’s low key also a thing on 14nm and 10nm class too. But it is already something that CPUs have to be designed around and designed to detect and monitor and tolerate as part of the boost algorithm (that stability margin is also headroom the boost algorithm wants to exploit), they devote an enormous amount of effort to electromigration already. And the mismatch between that public understanding of the problem and the reality is causing a lot of warranty claims. You can see from enterprise fleets that CPUs don’t normally fail, yet every enthusiast knows someone who had a chip die “even without overclocking! I just enabled XMP!”. Of the failed CPUs getting returned for warranty, probably a plurality are memory overclocking failures. And this is only going to continue to get worse over time - 2.5D and 3D packaging are both progressively even more sensitive due to thermals, and have tighter requirements for voltage stability since they need to talk to the other dies at very low voltages (especially across heterogeneous dies with different metal stacks/totally different processes etc).
https://semiengineering.com/3d-ic-reliability-degrades-with-...
https://semiengineering.com/on-chip-power-distribution-model...