The latest Stratechery interview had Pat Gelsinger on it and he was talking about how Intel is happy to package up TSMC dies in their foundries. Relevant quote:

> So it really brings together many of the things that Intel is doing as an IDM, now bringing it together in a heterogeneous environment where we’re taking TSMC dies. We’re going to be using other foundries in the industry, we’re standardizing that with UCIe. So I really see ourself as the front end of this multi-chip chiplet world doing so in the Intel way, standardizing it for the industry’s participation with UCIE, and then just winning a better technology.